Modeling and Simulation of Nanofluid Minimum Quantity Lubrication Surface Grinding Thermal Stress
Yanbin Zhang, Changhe Li*, Min Yang, Dongzhou Jia, Dongkun Zhang, Xiaowei Zhang
Identifiers and Pagination:Year: 2015
First Page: 761
Last Page: 768
Publisher Id: TOMEJ-9-761
Article History:Received Date: 17/2/2014
Revision Received Date: 21/3/2015
Acceptance Date: 6/9/2015
Electronic publication date: 30/9/2015
Collection year: 2015
open-access license: This is an open access article distributed under the terms of the Creative Commons Attribution 4.0 International Public License (CC-BY 4.0), a copy of which is available at: (https://creativecommons.org/licenses/by/4.0/legalcode). This license permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited.
The model of surface grinding with a nanoparticle jet flow of MQL was established. The surface grinding thermal stress of three workpiece materials, namely, 45 Steel, 2Cr13, and nano-ZrO2 dental ceramic, were numerically simulated. Results show that dry grinding generates larger tensile stress, whereas MQL grinding generates larger compressive stress. The finished surface of workpiece produces large tensile stress in grinding direction. With the increase of cutting depth, the time-related variation of thermal stress on finished surface slows down gradually. Residual stress is inversely proportional to cutting depth. With the increase of cutting depth, the finished surface of workpiece is firstly dominated by large tensile stress, which decreases continuously until reaching the maximum compressive stress. Deeper layer is less influenced by temperature field, manifested by smaller stress value and slight variation of the whole stress field.